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CHAPTER FOUR CONSTRUCTION APPROACH, CONSTRUCTION STEPS AND EVALUATION
CONSTRUCTION APPROACH
The approach of a system follows a definite pattern. The pattern followed to construct a system is not restricted to a definite mode but rather, it is dependent on the designer’s choice of approach. The approach enables the designer to organize the different stages of the system and the components to be used in order to achieve the desired aim.
In general, there are two types of design approach which are normally employed by every designer. They cannot be used together in one design but can be chosen alternatively. These approaches includes
- -Top-down design approach and
- -Down-top design approach
>Top-down design
This is a type of design approach employed by a designer when the system is designed from the input to the output. Once the target is named, the designer that chooses this mode designs the input of the system first. It is designed input that determines the condition or state of the system output.
>Down-top design
In this design approach, the system is designed from the output to the input. The design obtains the output state after naming the systems target and from the current state of the output; the input part of the system is designed. In this particular system design, we designed the system following a down-up design approach. The output condition of our system is what determines the state of the input
As regards to this system construction, the down-top design approach was employed. The output of the system was first considered before designing the input of the system. The major device that determined the power dissipation of the system was the motor that moves the gate. The device was taken into consideration before designing other parts of the system.
CONSTRUCTION
The construction of this project was carried out following the understated procedures;
COMPONENT TESTING
The components to be mounted were tested with the use of digital multi meter to ensure that their value is in concord with the values stated in the circuit diagram.
The components were also tested to ensure that they were in there operational standard.
COMPONENT PLACING
The individual components of the system were mounted on the Vero board with close observations made to the circuit diagram.
The components with polarities were observed and placed accordingly.
SOLDERING
After mounting the components on the Vero board, they were soldered using soldering iron and lead. The soldering was made to be firm to avoid loose parts that might introduce noise in the circuit.
SYSTEM TESTING
A continuity test was carried out between individual components to ensure that they link together as required.
A short circuit test was also carried out to check if there was the existence of wrong connections. The short circuit test was conducted between VCC and GROUND to make sure that they were not linked together. The test was also conducted between component connections to ensure that individual components are connected as they are supposed to.
CONSTRUCTION MATERIALS
The materials used in the construction of this project include the following;
- Soldering iron (60 watts).
- Lead.
- Vero board.
- Linking wire.
- Digital multi meter.
TESTING EQUIPMENT
Digital multi meter.
TESTING METHOD
RESISTORS:
These components were tested by adjusting the meter to its resistance part. The probes of the meter were placed end to end of the resistor. The reading shown by the meter was cross checked with the color codes of the resistor. If the reading exceeds the tolerance value of the resistor then the resistor is bad.
CAPACITORS:
The meter was set to continuity before testing. The capacitor is expected to charge and discharge when the probe is connected to both positive and negative terminal. Otherwise the capacitor is labeled to be bad
TRANSISTORS:
The meter is set to continuity. One probe of the meter is set to one terminal of the transistor while the other probe is alternated between the remaining two terminals of the transistor. A value is expected at base-emitter junction or base collector junction. The base-emitter reading has a higher resistance value compared to base-collector reading. If a reading is obtained at collector-emitter, then the transistor is bad. While the reading is being carried out, if black probe is at the base of the transistor, the transistor is a p-n-p transistor. Otherwise the transistor is an n-p-n transistor.
Title page
Approval page
Dedication
Acknowledgement
Abstract
Table of contents
List of figures
List of tables
CHAPTER ONE INTRODUCTION
1.1 BACKGROUND OF THE PROJECT
1.2 AIMS AND OBJECTIVE OF THE PROJECT
1.3 SCOPE OF THE PROJECT
1.4 DEFINITION OF TERMS
1.5 PROJECT REPORT ORGANIZATION
CHAPTER TWO LITERATURE REVIEW
2.1 INTRODUCTION
2.2 REVIEW OF SENSORS
2.3 REVIEW OF THE ATMEL AT89S52 MICROCONTROLLER
2.4 REVIEW OF DOOR CONTROL
CHAPTER THREE SYSTEM ANALYSIS
3.1: INTRODUCTION
3.2: THE POWER SUPPLY UNIT:
3.3: THE CONTROL SECTION:
3.4: THE SENSOR UNIT:
3.5: THE GATE DRIVE UNIT
3.6: DESCRIPTION OF COMPONENTS USED IN THE DESIGN
3.7: SYSTEM SPECIFICATION
CHAPTER FOUR CONSTRUCTION APPROACH, CONSTRUCTION STEPS AND EVALUATION
4.1 CONSTRUCTION APPROACH
4.2 CONSTRUCTION
4.3 TESTING EQUIPMENT
4.4 TESTING METHOD
4.5 SYSTEM FLOWCHART
4.6 CIRCUIT DIAGRAM:
4.7 EVALUATION
CHAPTER FIVE TEST RESULT, RECOMMENDATION AND CONCLUSION
5.1 SYSTEM TESTING
5.2 SUMMARY
5.3 RECOMMENDATION
5.4 CONCLUSION
REFERENCES
APPENDIX
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CONSTRUCTION OF A MICROCONTROLLER BASED GATE
