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Table of contents
Remerciements
Résumé en français
List of figures
List of tables
General Introduction
CHAPTER 1. State of The Art
1.1. Introduction
1.2. Power Converters
1.2.1. Semiconductor Components
1.2.2. Multilevel Converters
1.3. Power Packaging
1.3.1. Introduction
1.3.2. 2D Packaging with Direct Bonded Circuit (DBC) Technology
1.3.3. 3D Packaging with Printed Circuit Board (PCB) Technology
1.3.4. Conclusion
1.4. Thermal Analysis of Power Electronics Systems
1.4.1. Introduction
1.4.2. Thermal Measurement Methods
1.4.3. Thermal Management Solutions
1.5. Summary
CHAPTER 2. Thermal Instrumentations
2.1. Introduction
2.2. Test Bench
2.2.1. Establishment
2.2.2. RTD Sensor (PT 100) Calibration
2.2.3. Thermal Conductivity of Duralumin 𝜆dura (W/mK)
2.2.4. Temperature Measurement Equipments
2.2.5. Applied Softwares
2.3. Chip Attachment on The PCB Substrate
2.3.1. Preparation of PCB Substrate
2.3.2. Chip Soldering
2.4. Through-Hole Electroplating
2.5. Summary
CHAPTER 3. Optimization of thermal vias
3.1. Introduction
3.2. Analytical Analysis
3.2.1. PCB Substrate with One Individual Thermal Via
3.2.2. PCB Substrate with Two Thermal Vias
3.2.3. PCB Substrate with Multiple Vias
3.3. 3D FEM Analysis
3.3.1. Number of Thermal Vias N
3.3.2. Via-Cluster Surface Ratio Ro1
3.3.3. Via Diameter Ratio Ro2
3.3.4. Via Plating Thickness Ratio Ro3
3.3.5. Via Pattern
3.3.6. Copper Thickness on The PCB Substrate
3.4. Experimental Results and Discussions
3.5. Conception of The Inverse Thermal Model
3.5.1. Introduction
3.5.2. Steady State Inverse Heat Conduction Model (IHCM)
3.5.3. Dissipated Power Prediction
3.5.4. Dissipated Power and Thermal Conductivity Prediction
3.6. Summary
CHAPTER 4. Thermoelectric Cooling
4.1. Introduction
4.2. 3D FEM Analysis
4.2.1. Placement of The Peltier Device dgp and Number of Peltier Elements Np
4.2.2. Copper Thickness on The PCB Substrate
4.2.3. Modeling of The Peltier Device CP39236H
4.3. 1D Electro-Thermal Modeling
4.3.1. 1D Modeling of The Cooling Structure
4.3.2. 1D and 3D Simulation Results and Discussions
4.4. Experimental Validation
4.4.1. Test Bench
4.4.2. Results and Discussions
4.4.3. Influences of Number of Peltier Elements N
4.5. Summary
Conclusions and Perspectives
References
Annex A
Annex B
Annex C
Annex D
