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Table of contents
General introduction
Chapter I. State of the art on ALD and its application to corrosion protection
I.1. Atomic Layer Deposition
I.1.1. Introduction
I.1.2. Terminology
I.1.3. The mechanism and main features of ALD
I.1.4. Main advantages of ALD
I.1.5. Non-ideal ALD behaviour
I.1.6. Limitations of ALD
I.1.7. Precursors and their requirements in ALD
I.1.8. Nucleation and growth in ALD
I.1.9. Film morphology
I.1.10. ALD of alumina (Al2O3)
I.2. ALD for corrosion protection
Chapter II. Experimental
II.1. Substrate preparation
II.1.1. Copper substrate
II.1.1.1. Mechanical polishing
II.1.1.2. Electropolishing
II.1.1.3. Annealing
II.1.1.4. Oxide removal pre-treatment
II.1.2. Aluminium substrate
II.1.2.1. Mechanical polishing
II.2. ALD coating deposition
II.3. Surface analysis
II.3.1. Time-of-Flight Secondary Ion Mass Spectrometry
II.3.1.1. Principles
II.3.1.2. Instrumentation and analytical conditions
II.3.2. Atomic Force Microscopy
II.3.2.1. Principles and instrumentation
II.3.3. Scanning Electron Microscopy
II.4. Electrochemical analysis
II.4.1. Experimental conditions
II.4.1.1. Instrumentation
II.4.1.1.1. Electrochemical cell
II.4.1.1.2. Potentiostat
II.4.2. Techniques
II.4.2.1. Open Circuit Potential vs time
II.4.2.2. Electrochemical Impedance Spectroscopy
II.4.2.3. Linear Sweep Voltammetry
Chapter III. Analysis of the corrosion protection of copper by ALD alumina coatings and effect of deposited layer thickness
III.1. Introduction
III.2. Electrochemical behaviour of bare Cu substrate
III.2.1. Linear sweep voltammetry
III.2.2. Electrochemical Impedance Spectroscopy
III.3. Surface and electrochemical analysis of Cu coated with ALD Al2O3
III.3.1. Time-of-Flight Secondary Ion Mass Spectrometry
III.3.2. Atomic Force Microscopy
III.3.3. Linear Sweep Voltammetry
III.3.4. Electrochemical Impedance Spectroscopy
III.4. Conclusions
Chapter IV. Effect of the interfacial native oxide layer on the corrosion of ALD alumina coated copper
IV.1. Introduction
IV.2. Electrochemical analysis of bare substrates
IV.2.1. Electrochemical Impedance Spectroscopy
IV.2.2. Linear Sweep Voltammetry
IV.3. Surface and electrochemical analysis of coated substrates
IV.3.1. Time-of-Flight Secondary Ion Mass Spectrometry on pristine coated samples
IV.3.2. Electrochemical Impedance Spectroscopy
IV.3.3. Linear Sweep Voltammetry
IV.3.4. Time-of-Flight Secondary Ion Mass Spectrometry of polarized coated samples
IV.4. Conclusions
Chapter V. Effect of copper substrate annealing on the corrosion protection of ALD alumina coatings
V.1. Introduction
V.2. Time-of-Flight Secondary Ion Mass Spectrometry of pristine coated samples
V.3. Atomic Force Microscopy
V.4. Linear Sweep Voltammetry
V.5. Electrochemical Impedance Spectroscopy
V.6. Scanning Electron Microscopy
V.7. ToF-SIMS surface images
V.8. Conclusions
Chapter VI. Durability of the corrosion protection of copper by ALD alumina coating
VI.1. Introduction
VI.2. Electrochemical Impedance Spectroscopy
VI.3. Time-of-Flight Secondary Ion Mass Spectrometry
VI.4. Atomic Force Microscopy
VI.5. Conclusions
Chapter VII. Investigation of corrosion protection of aluminium by ALD alumina coatings and effect of deposited layer thickness
VII.1. Introduction
VII.2. Electrochemical behaviour of bare Al substrate
VII.2.1. Corrosion mechanisms
VII.2.2. Linear Sweep Voltammetry
VII.2.3. Electrochemical Impedance Spectroscopy
VII.3. Surface analysis and electrochemical study of coated samples
VII.3.1. Time-of-Flight Secondary Ion Mass Spectrometry of pristine samples
VII.3.2. Linear Sweep Voltammetry of coated aluminium
VII.3.3. Electrochemical Impedance Spectroscopy of ALD coated aluminium
VII.4. Conclusions
General conclusions
References
